Livermore, Calif.-based Adept Technology Inc. today said it has teamed with DEK Printed Machines Ltd. to develop a fully automated wafer handling system for DEK’s screen printer wafer bumping and ball ...

ERS's new Luminex machines offer a unique solution for stress-free debonding, saving more than 30% in operation costs compared to traditional laser debonding. They are engineered with robust wafer ...

SAN JOSE, Calif. — Citing renewed demand, Singapore's STATS ChipPAC Ltd. is expanding its capacity for wafer-level packaging. STATS ChipPAC has been on a production ramp with wafer-level packaging ...

Wafers are transported between stages in the EFEM and cleaning module. In the grinding module, the wafers move from rough grinding to finish grinding as the index table rotates. To improve the ...

LONDON--(BUSINESS WIRE)--Technavio’s latest market research report on the global fan-out wafer level packaging (FOWLP) market provides an analysis on the most important trends expected to impact the ...

Similarly, wafer-level packaging techniques demand materials that can withstand backgrinding, polishing, and etching while allowing clean removal post-processing. As high-frequency, power, and ...

BANGALORE, India, May 16, 2025 /PRNewswire/ -- The Global Temporary Wafer Bonding Materials Market is Segmented by Type (Thermoplastic Materials, UV Curing Materials, Composite Films, Metallic ...