For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.

The packaging industry enters 2026 under regulatory and sustainability pressures after a year of smart and bio-based ...

Packaging has always been a balancing act. Consumer packaged goods (CPG) companies must weigh cost versus performance and market appeal versus machinability. As interest in sustainable packaging has ...

Digital twins dominated discussions at SEMICON West this year, appearing in keynote presentations, panel sessions, and workshops. The conversation reflected a noticeable shift in how the industry ...

It’s become increasingly difficult to ignore the impact waste and carbon emissions are having on the climate, from changing weather patterns to rising sea levels. While many countries across the globe ...

The continued unbundling of SoCs into multi-die packages is increasing the complexity of those designs and the amount of design data that needs to be managed, stored, sorted, and analyzed. Simulations ...

Dr. Steen Tjarks is the CEO at T&T Design, a global packaging and artwork agency that specializes in private label. Private-label products have seen significant growth globally, and I see packaging ...