TSMC is planning to adopt double patterning extensively at 20nm, despite the high cost of doing so. Why? Because EUV hasn't come through. Share on Facebook (opens in a new window) Share on X (opens in ...
As the optical lithography advances into the sub-30nm technology node, the various candidates of lithography have been discussed. Double dipole lithography (DDL) has been a primary lithography ...
Researchers, equipment vendors, and manufacturers alike are watching with growing concern as we creep every closer to the end of 193 nm optical lithography. The problem is not that there are no ...
Sematech and the Semiconductor Metrology Systems (SMS) division of Carl Zeiss claim to have reached a key development milestone in the development of a next generation photomask registration and ...
TOKYO--(BUSINESS WIRE)--Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has successfully achieved the fine pattern resolution required for photomasks for logic semiconductors of the beyond 2nm (nm: ...
Advanced Semiconductor Device Lithography – what is going to happen next ? The noise and hype level around lithography these days is rather loud. At SPIE’s Advanced Lithography conference this year, a ...
LEUVEN, BELGIUM: IMEC, in collaboration with JSR Corp. realized a simplified process using only one etch step to reduce the cost of double patterning. 32nm lines and spaces were printed with a double ...
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