Osram Opto Semiconductors has introduced the first compact laser multi-chip package. The PLPM4 450 module can pack up to 20 blue laser chips into a single "butterfly" package for projection ...
Built 70% smaller than its predecessor, the ROK104001 Bluetooth multi-chip module has been developed to speed time-to-market by enabling designers to quickly implement qualified and tested Bluetooth ...
TL;DR: Apple's iPhone 18 will feature the next-gen A20 chip using TSMC's advanced WMCM packaging with MUF technology, enhancing efficiency and yield. Eternal secured a major contract as a packaging ...
Tesla has been granted a patent for a multi-chip module design featuring a Redistribution Layer substrate with IC dies mounted on both surfaces, sockets, and a cold plate. The innovative mounting ...
Qorvo, Inc. has launched three new highly integrated RF multi-chip modules (MCMs) designed for advanced radar applications. Leveraging Qorvo’s advanced packaging and process technology, the QPF5001, ...
ELMSFORD, N.Y.--(BUSINESS WIRE)--SEEQC, the digital quantum computing company, today introduced a family of high speed, energy-efficient Single Flux Quantum (SFQ) digital chips capable of running all ...
A new technical paper titled “Leveraging Chiplet-Locality for Efficient Memory Mapping in Multi-Chip Module GPUs” was published by researchers at Electronics and Telecommunications Research Institute ...
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