Startup Substrate is building next-generation semiconductor fabs using advanced X-ray lithography. This goes beyond extreme ...

ASML Holding ASML, a leading manufacturer of semiconductor lithography tools, is at the center of a major shift in advanced ...

TSMC is planning to adopt double patterning extensively at 20nm, despite the high cost of doing so. Why? Because EUV hasn't come through. Share on Facebook (opens in a new window) Share on X (opens in ...

As semiconductor technology advanced from 65nm to 7nm over the last 10 years, new challenges have arisen in design and manufacturing. Securing the IC yield means developing new methods that respond to ...

The semiconductor industry is moving full speed ahead to develop high-NA EUV, but bringing up this next generation lithography system and the associated infrastructure remains a monumental and ...

2019 marked an important milestone for extreme ultraviolet (EUV) lithography. In that year, the EUV patterning technology was for the first time deployed for the mass production of logic chips of the ...

The future of semiconductor technology is often viewed through the lenses of photolithography equipment, which continues to offer better resolution for future process nodes despite an almost perpetual ...

Research and innovation hub imec has produced patterned structures obtained after exposure with the 0.55NA EUV scanner in the joint ASML-imec High NA EUV Lithography Lab in Veldhoven, the Netherlands.

Steven Scheer: "The opening of the joint ASML-imec High NA EUV Lithography Lab in Veldhoven, the Netherlands, marked a milestone in preparing High NA EUV for adoption in mass manufacturing [1].