Eunil H.A. Americas has added the PARMI SPI HS30 in-line solder paste inspection system to its product line. The SPI HS30 uses a 3D laser triangulation sensor and intelligent vision algorithm to ...

Many companies employ some kind of inspection to verify process steps within their surface-mount technology (SMT) lines. Because solder-paste volume is an important predictor of solder-joint quality ...

Test Research of Taiwan has revealed its latest automatic solder paste inspection machine using 3D vision, that can also inspect bumps, flux, mini LEDs and bare boards. Called TR7007Q SII it has a ...

Flip chip microelectronic packaging has emerged as a cornerstone technology in modern semiconductor assembly, wherein the die is mounted upside down to the substrate to facilitate direct ...

X-ray and advanced automated techniques combine to create a capable tool for lead-free solder inspection needs. Within two years, solder used in electronics manufactured or sold in Europe must meet ...