With the advent of the Internet and multimedia, electronics miniaturization in the form of integrated circuits has become an indispensable part of our lives. To ensure its long-term operation and ...

In its ongoing push to create smaller, thinner, and denser chip packages, the semiconductor industry has intensified its focus on integrating separately manufactured components with different ...

SAN JOSE — KLA-Tencor Corp. here has introduced a new option for its Aset-F5x thin-film metrology tool that measures wafer bow and wafer stress on 300-mm silicon substrates. KLA-Tencor said the option ...

Imec has developed a Cu-to-Cu and SiCN-to-SiCN die-to-wafer bonding process resulting in a Cu bond pad pitch of only 2µm at <350nm die-to-wafer overlay error, achieving good electrical yield. Such ...