GRENOBLE, France--(BUSINESS WIRE)--Hprobe, a provider of turnkey semiconductor Automatic Test Equipment (ATE) for magnetic devices, today announced a breakthrough magnetic test head revolutionizing ...

Test-flow partitioning between wafer sort and final package test can have a dramatic impact on the cost of test. In some cases, the migration of package tests can be done over time, but the test ...

LONDON—European chip company STMicroelectronics NV has said it has produced the first wafer on which the die were fully tested wirelessly and without the use of contact probes. The EMWS ...

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, announced the successful production of the world’s first semiconductor wafer whose ...

A new technical paper titled “Design and Implementation of Test Infrastructure for Higher Parallel Wafer Level Testing of System-on-Chip” was published by researchers at Inha University and Teradyne. ...

High testing parallelism can be achieved with contactless wafer testing, which leads to reduced production cycle times. It also eliminates the possibility of wafer damage during testing. According to ...

NORTH READING, Mass.--(BUSINESS WIRE)-- Teradyne, a leading provider of automated test equipment, has partnered with ficonTEC, a global leader in production solutions for photonics assembly and test, ...

The high costs of building, resourcing and operating a foundry fabricating integrated circuits are well known. Fabless companies avoid this capital cost and focus on design and innovation in their ...

“Semiconductor content in automobiles is increasing rapidly as ICs are becoming integral in everything from powertrains and infotainment systems to ADAS (advanced driver-assistance systems) and ...

The world’s fastest automated photonic alignment with nine-axis nano-precision, delivering significantly higher throughput compared to other technologies. Full integration of FormFactor’s Velox™ probe ...