Abstract: ASIC design and fabrication traditionally require large budgets, such as millions of dollars per mask set, and the use of expensive design tools. However ...
Abstract: In the design of Application Specific Integrated Circuit (ASIC) chips, Triple Modular Redundancy (TMR) is a commonly used technology to effectively improve the chip's capability of resisting ...
Driven On-Chip Integration for High Density and Low Cost” was published by researchers at University of Southern California.
Scientists at Ames National Laboratory, in collaboration with Indranil Das's group at the Saha Institute of Nuclear Physics ...
An agentic AI-based approach to end-to-end bug resolution using both error logs and waveforms.
His work is helping UC San Diego become a driving force in the nation’s growing semiconductor innovation ecosystem. Photo by ...
Public records clearly shows that for the past 25 years, CERN has repeatedly built inadequate FPGA-based Level-1 Triggers, necessitating multiple rebuilds. During the Higgs boson discovery ...
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