First-order derivatives: n additional function calls are needed. Second-order derivatives based on gradient calls, when the "grd" module is specified (Dennis and Schnabel 1983): n additional gradient ...

A new technical paper titled “Thermo-mechanical co-design of 2.5D flip-chip packages with silicon and glass interposers via ...

Abstract: In feature learning (FL), structural information shows advantages in retaining information and maintaining stability. Graph diffusion, a graph learning method that can focus on neighborhood ...

Abstract: With the increase of chip complexity, the design and production of substrates and chip tend to be "integrated", and ceramic substrates has been more and more widely used due to its ...

This code simulates the 1D heat conduction in a spherical body with multiple layers of different material compositions of varying thicknesses in the radial direction. This code is based on the ...