Delicate features, uneven surfaces, and extreme density make it difficult to manage probe force and ensure reliability.

As chip designs become larger and more complex, especially for AI and high-performance computing workloads, it’s often not feasible to fit everything onto a single planar die. But determining when to ...

Doug Lefever, representative director and group CEO, Advantest Corp, accepting this year’s award from TSMC Senior Vice President and Deputy Co-COO, Dr. Cliff Hou. · GlobeNewswire Inc. TOKYO, Dec. 24, ...

TOKYO, Dec. 24, 2025 (GLOBE NEWSWIRE) -- Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) today announced that it has been named a winner of TSMC’s Excellent Performance ...

Gudeng Precision Industrial Co., Ltd. provides technology services worldwide. The company offers wafer handling solutions, including shipping boxes, cassette boxes, wafer cassettes, and front opening ...

Abstract: Wafer maps of large-scale integration chips are matrices showing the defective chip position on a wafer. Determining defect patterns on wafer maps is crucial because these patterns indicate ...

SPEL Semiconductor Limited is an integrated circuit assembly and test company. The Company provides full turnkey solutions that include wafer sort, assembly, test and drop-shipment services which help ...

ChipMOS TECHNOLOGIES INC. engages in the research and development, manufacture, and sale of integrated circuits, and related assembly and testing services in Taiwan, Japan, the People’s Republic of ...

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