Thermal Modeling in Emerging Heterogeneous 2.5D/3D Systems (EPFL, Universidad Complutense de Madrid)
Accurate and efficient thermal modeling for 2.5D/3D heterogeneous chiplet systems” was published by researchers at EPFL and ...
However, it is consistent with the earlier report, and is certainly interesting to play with if you have a 3D printer and are ...
Advanced packaging technologies are reshaping how compute platforms are conceived, optimized, and manufactured.
Stanford, CMU, Penn, MIT, and SkyWater Technology reached a major milestone by producing the first monolithic 3D chip ...
Abstract: Artificial neural network (ANN) is a useful technique for active device modeling. However, it shows limitations in the extrapolation region. To address this issue, we propose a novel ...
Explore the Prusa Research Core One Open Source project. Download, modify, and reuse CAD files for innovative 3D printing solutions.
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