Accurate and efficient thermal modeling for 2.5D/3D heterogeneous chiplet systems” was published by researchers at EPFL and ...

Advanced packaging technologies are reshaping how compute platforms are conceived, optimized, and manufactured.

Rolling two six-sided dice (2d6) gives results from 2 to 12 with a bell curve distribution. Seven being the most common result, two and twelve being the least common. But what if one could do this ...

Lam Research (LRCX), with a $180 billion market cap, is one of the world’s most essential yet underappreciated semiconductor equipment companies. As the third-largest player globally, it provides ...

Bell Labs is already highly recognized, but in its centennial year, the organization hoped to add more awards to burnish its ...

Editor’s Note: December 10, 2025: We’ve reviewed these selections to ensure they are available and competitively priced. To further update our coverage, with a focus on ease-of-use, we’ve called in ...

Abstract: Artificial neural network (ANN) is a useful technique for active device modeling. However, it shows limitations in the extrapolation region. To address this issue, we propose a novel ...

Abstract: We develop a charge deficit-based non-quasi-static (NQS) model that is compatible with neural network-based transistor compact models for transient, AC, and RF simulations. The charge ...

We compare our multi-agent architecture MEDA with recent state-of-the-art CAD generation framework CADCodeVerify across three CAD evaluation metrics and compilation rate as shown in the table below.

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