However, it is consistent with the earlier report, and is certainly interesting to play with if you have a 3D printer and are ...

Researchers have created a new kind of 3D computer chip that stacks memory and computing elements vertically, dramatically ...

Using AI and machine learning as transformative solutions for semiconductor device modeling and parameter extraction.

Advanced packaging technologies are reshaping how compute platforms are conceived, optimized, and manufactured.

Stanford, CMU, Penn, MIT, and SkyWater Technology reached a major milestone by producing the first monolithic 3D chip ...

Explore the Prusa Research Core One Open Source project. Download, modify, and reuse CAD files for innovative 3D printing solutions.

Abstract: Artificial neural network (ANN) is a useful technique for active device modeling. However, it shows limitations in the extrapolation region. To address this issue, we propose a novel ...

Abstract: We develop a charge deficit-based non-quasi-static (NQS) model that is compatible with neural network-based transistor compact models for transient, AC, and RF simulations. The charge ...

Lam Research (LRCX), with a $180 billion market cap, is one of the world’s most essential yet underappreciated semiconductor equipment companies. As the third-largest player globally, it provides ...