Abstract: In this study, the first 3D direct integration of a SiC power MOSFET and its SiC CMOS gate driver is achieved using flip chip bonding, enabling a wire bondless connection. Switching ...
If you’re in the market for a new headset, you don’t want to sleep on Corsair’s new Void Max Wireless V2. It’s the upgraded ...
Abstract: In this paper, we present a method for scan planning of a system for nondestructive testing of reactor pressure vessels (RPVs). The system consists of a central nacelle hanging on the cables ...
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