Researchers have created a new kind of 3D computer chip that stacks memory and computing elements vertically, dramatically ...

Advanced packaging technologies are reshaping how compute platforms are conceived, optimized, and manufactured.

Accurate and efficient thermal modeling for 2.5D/3D heterogeneous chiplet systems” was published by researchers at EPFL and ...

Stanford, CMU, Penn, MIT, and SkyWater Technology reached a major milestone by producing the first monolithic 3D chip ...

Explore the Prusa Research Core One Open Source project. Download, modify, and reuse CAD files for innovative 3D printing solutions.

Growing Inclination toward Miniaturization and Adoption of Advanced Manufacturing Processes Deposition equipment segment to record highest CAGR of front-end semiconductor manufacturing equipment ...

Computer-aided design (CAD) is the go-to method for designing most of today's physical products. Engineers use CAD to turn 2D sketches into 3D models that they can then test and refine before sending ...

Abstract: The reuse of 3D CAD models is crucial for industrial manufacturing because it shortens development cycles and reduces costs. Significant progress has been made in deep learning-based 3D ...

TL;DR: AMD's Instinct MI350 series AI accelerators, built on TSMC's advanced N3P process, deliver enhanced AI performance with 185 billion transistors, up to 288GB HBM3E memory, and superior power ...

There’s a new free AI-powered 3D CAD tool called “Zoo Design Studio”. Zoo Design is a California operation that has produced a new tool that provides simple parametric 3D CAD design features, such as ...

In a significant advancement for semiconductor technology, researchers at UC Santa Barbara have unveiled novel three-dimensional (3D) transistors utilizing two-dimensional (2D) semiconductors. Their ...